Monday, July 6, 2020
Home Industry Intel's Lakefield chips arrive for form factors such as foldables and dual...

Intel’s Lakefield chips arrive for form factors such as foldables and dual screens

Intel's smallest, boldest x86 chip design is here.

What’s the skinny? Earlier today Intel announced its launch of their processors with Intel® Hybrid Technology, code-named “Lakefield.” The Lakefield processors leverage Intel’s Foveros 3D packaging technology and features a hybrid CPU architecture. Intel says that this will allow for power and performance scalability that will deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors.

“Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future.”
–Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms

Intel says their Intel Core processors with Intel Hybrid Technology will deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board size. They will also extend battery life and are Intel’s first processors to feature dual internal display pipes which is ideal for foldables and dual-screen PCs.

Foveros

Intel describes Foveros as a layered cake where instead of having the various IP’s spread flat out in two dimensions they are stacked in three dimensions like a layered cake. “Intel’s Foveros advanced packaging technology allows Intel to “mix and match” technology IP blocks with various memory and I/O elements – all in a small physical package for significantly reduced board size.”

Key Features

Intel Core i5 and i3 processors with Intel Hybrid Technology leverage a 10nm Sunny Cove core to take on more intense workloads and foreground applications, while four power-efficient Tremont cores balance power and performance optimization for background tasks. The processors are fully compatible with 32- and 64-bit Windows applications, helping reach new heights for the thinnest and lightest designs.

  • Smallest package size, enabled by Foveros: With Foveros 3D stacking technology, processors achieve a dramatic reduction in package area – now only a miniscule 12x12x1 mm, approximately the size of a dime – by stacking two logic dies and two layers of DRAM in three dimensions, also eliminating the need for external memory.
  • Hardware-guided OS scheduling: Enabling real-time communication between the CPU and the OS scheduler to run the right apps on the right cores, the hybrid CPU architecture helps deliver up to 24% better performance per SOC power3 and up to 12% faster single-threaded integer compute-intensive application performance4.
  • More than 2x throughput on Intel UHD for AI-enhanced workloads5: Flexible GPU engine compute enables sustained, high-throughput inference applications – including AI-enhanced video stylization, analytics and image resolution upscaling.
  • Up to 1.7x better graphics performance6: Gen11 graphics delivers seamless media and content creation on the go – the biggest leap in graphics for Intel processor-based 7-watt systems. Convert video clips up to 54% faster7, and with support for up to four external 4K displays, immerse in rich visuals for content creation and entertainment.
  • Gigabit connectivity: With support for Intel® Wi-Fi 6 (Gig+) and Intel LTE solutions, experience seamless video conferencing and streaming online.
Photo credit: Intel
Processor NumberGraphicsCores / ThreadsGraphics (EUs)CacheTDPBase Freq (GHz)Max Single Core Turbo (GHz)Max All Core Turbo (GHz)Graphics Max Freq (GHz)Memory
i5-L16G7Intel UHD Graphics5/5644MB7W1.43.01.8Up to 0.5LPDDR4X-4267
i3-L13G4Intel UHD Graphics5/5484MB7W0.82.81.3Up to 0.5LPDDR4X-4
Chart credit: Intel

The i5 and i3 variants both feature a single large 10nm core, either an i5 or i3 along with four atom cores. The idea here is that the large single core will do the heavy lifting while the atom cores deal with less intensive tasks. Both of these chips also come with Intel’s 11th generation graphics.

When can you get it: Intel says they are expected to start showing up in select markets starting in June and since we are already in June I guess we can start seeing them any time now, starting with the  Lenovo ThinkPad X1 Fold and the Samsung Galaxy Book S.

Avatar
Charles Leverehttps://www.riverbankwebdesign.ca/
Charles Levere is the editor-in-chief (dork-in-chief) of Urban Dork. When he is not writing, or tinkering with hardware, he is most likely playing one of his favorite video games. He also loves being near the water, kayaking, water skiing or anything that gets him on the water and in the sun.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

Most Popular

Walmart is partnering with Tribeca to bring drive-in theaters to 160 store parking lots

What's the skinny? With everyone understandably weary of going into movie theaters with the pandemic still ongoing, Walmart has partnered with Tribeca....

Samsung’s new 870 QVO lineup offers up to 8TB of SSD storage

What's the skinny? Earlier today, Samsung introduced its second-generation quad-level cell (QLC) flash drive, the 870 QVO SATA SSD. The latest lineup...

Twitch serves temporary ban to Donald Trump’s campaign account

What's the skinny? The popular video game streaming platform Twitch, temporarily bans an account tied to Donald trump's campaign; citing hateful conduct...

Google makes it easier to find local COVID-19 information

What's the skinny? Google understands that trying to find relevant and accurate information regarding COVID-19 and how it is impacting your neighborhood...

Recent Comments